CMOS Area Image Sensor(Dynastron™)
In its pursuit of further miniaturization and higher performance, Toshiba offers a new Dynastron CMOS image sensor with a pixel pitch of 1.75 μm, reduced from 2.2 μm.
The new image sensor is available in pixel counts ranging from 2.0 M to 8 M.
The Dynastron technology provides high-quality imaging, thanks to the use of a microlens and an optimized array of photodiodes.
The new image sensor opens up new possibilities for mobile handsets such as camera phones.
- Dynastron is a trademark of Toshiba Corporation.
2-M Dynastron™ ET8EM0 **
3.2-M Dynastron™ ET8EM1
5-M Dynastron™ ET8EM2 **
8-M Dynastron™ ET8EN2 **
- Features
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- Dynastron technology provides world-class image quality.
- The integrated PLL provides great flexibility in the selection of input clocks.
- Offers blemish correction, gain control, etc.
- Command controlled via the I2C bus.
General Specifications
| Part Number | ET8EN2 ** | ET8EM2 ** | ET8EM1 | ET8EM0 ** |
|---|---|---|---|---|
| Optical Format | 1/2.6 inch | 1/3.2 inch | 1/4 inch | 1/5 inch |
| Pixel Count | Approx. 8 M 3,280(H）× 2,464(V) |
Approx. 5 M 2,584(H）× 1,960(V) |
Approx. 3.2 M 2,060(H）× 1,548(V) |
Approx. 2 M 1,616(H）× 1,216(V) |
| Cell Size | 1.75μm × 1.75μm | 1.75μm × 1.75μm | 1.75μm × 1.75μm | 1.75μm × 1.75μm |
| Output Signaling | RAW | RAW | RAW | YUV/RGB/RAW |
| Frame Rate | 7.5 fps at full resolution | 12 fps at full resolution | 15 fps at full resolution | UXGA@15 fps VGA@30 fps |
| Control Bus | I2C | I2C | I2C | I2C |
| ISP | None | None | None | Integrated |
- ISP：Image Signal Processor
- **：Under development
Dynastron™ Roadmap
CSCM (Chip Scale Camera Module)
- The first camera modules manufactured using Through-Chip Via (TCV) technology
- Toshiba now offers a family of chip scale camera module (CSCM*1) with a DynastronTM CMOS image sensor. They are the first*2 to use TCV*3 technology.
- In the last few years, cellular phones and other mobile devices are coming in smaller and smaller form factors. This is driving the need for smaller, yet higher-quality camera modules to be able to incorporate digital camera functionality into these space-critical applications.
- TCV technology uses a chip structure with built-in pass-through electrodes and allows the mounting and assembly of camera modules in the semiconductor wafer. With solder balls on the bottom of the substrate, the CSCM requires no wire bonding space, delivering a 64% reduction*4 in module size compared to Toshiba’s conventional camera modules manufactured with the same VGA sensors.
- The use of heat-resistant lenses and solder balls permits reflow soldering*5 and thus simplifies the pc board mounting of camera modules. This contributes to a reduction in the manufacturing process of surface-mount pc boards.
- *1: The chip scale camera module is a ultra-small camera module that allows the mounting and assembly of camera module components at the wafer level.
- *2: As of October 1, 2007, according to a survey by Toshiba.
- *3: Through-Chip Via, for cutting holes and running electrodes through the wafer.
- *4: Comparison with Toshiba's conventional camera modules manufactured with the same sensor chip.
- *5: Surface-mount assembly process in which components are temporarily mounted on the pc board using solder paste, after which the board is passed through a temperature-controlled oven in order to solder the joint.
Comparison Between the Conventional and CSCM Camera Modules
General Specifications
| Part Number | TCM9200MD | TCM9000MD |
|---|---|---|
| Module Size | 6.31mm(X) × 6.41mm(Y) × 4.35mm(H) | 4.00mm(X) × 4.00mm(Y) × 2.23mm(H) |
| Total Pixel Count | 1,648(H) × 1,216(V) UXGA | 648(H) × 492(V) VGA |
| Cell Size | 2.2μm(H) × 2.2μm(V) | 2.2μm(H) × 2.2μm(V) |
| Output Signaling | YUV/RGB/RAW | YUV/RAW |
| Output Format | 8-bit parallel | 8-bit parallel |
| Frame Rate | 15 frames per second (UXGA output) 30 frames per second (VGA output) |
30 frames per second (VGA output) |
| Control Signal | I2C bus | I2C bus |
- For detailed information, contact your nearest Toshiba sales representative.
- The specifications of the products being developed are subject to change.
